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Vol. 197, Issue 2, February 2016, pp. 14-19

 

Bullet

 

Characteristics Research of the Three Dimensional Hall Magnetic Field Sensor
Based on Packaging Technology
 

* Zhao Xiaofeng, Yang Xianghong, Li Baozeng and Wen Dianzhong

Key Laboratory of Electronics Engineering, College of Heilongjiang Province, Heilongjiang University, Harbin, 150080, China
* Tel.: +86 451 8660 8413

E-mail: zhaoxiaofeng@hlju.edu.cn, wendianzhong@hlju.edu.cn

 

Received: 11 January 2016 /Accepted: 11 February 2016 /Published: 29 February 2016

Digital Sensors and Sensor Sysstems

 

Abstract: This paper presents a three dimensional (3D) magnetic field sensor composed of three Hall elements with similar characteristics. Through adopting complementary metal oxide semiconductor (CMOS) technology, the chips of Hall element were designed and fabricated on the p-type silicon substrate with high resistivity. Based on the wire bonding technology, the Hall sensors were packaged on printed circuit boards (PCBs), allocating on three faces of a synthetic resin cube (10 10 10 mm3) to form an orthogonally directional array. When the supply voltage is 5.0 V, the magnetic sensitivities in x axis, y axis and z axis are 137.7 mV/T, 137.2 mV/T and 136.7 mV/T at room temperature, respectively. The experimental results show that the packaging device can achieve the measurement to 3D magnetic field.

 

Keywords: 3D Hall magnetic field sensor, CMOS technology, Packaging technology, Error analysis.

 

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