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Vol. 228, Issue 12, December 2018, pp. 63-70




A Novel Approach for Simple, Fast and Cheap Packaging of MEMS and MMIC

1, 2 G. A. MERLETTI, 2 J. A. LONAC, 3 J. J. ORTIZ, 4 D. CASULLA, 4 C. F. LONGO, 4 D. de LIMA, 4 C. L. ARRIETA

1 DEINSO-CITEDEF (UNIDEF-MINDEF-CONICET), Juan Bautista de La Salle 4387 (B1603ALO). Buenos Aires (Argentina)
2 CONICET – National Council of Scientific and Technical Research, Godoy Cruz 2290 (C1425FQB) Buenos Aires (Argentina)
3 UTN FRC, Mechanical Engineering Dept, Córdoba (Argentina)
4 Microelectronics Division, DEA-CITEDEF, Villa Martelli, Bs. As. (Argentina)

E-mail: gmeletti@citedef.gob.ar, carrieta@citedef.gob.ar


Received: 8 October 2018 /Accepted: 30 November 2018 /Published: 31 December 2018

Digital Sensors and Sensor Sysstems


Abstract: The packaging of MEMS and MMIC devices has become a trending topic in the last years. This paper presents a novel approach for MEMS and MMIC packaging. The proposed packaging procedure combines simple single layer printed circuit board (PCB) techniques, Wire-Bonding and 3D printing, resulting in a simple, fast and cheap alternative. Since there is no need for Via Holes the package performance is privileged while the fabrication process is simplified. The novel approach was used in the design and fabrication of a package for a RF MEMS digital phase shifter. The simulation and measurements data are presented alongside with the related conclusions.


Keywords: Packaging, MEMS, MMIC, PCB, LTCC, Wire-Bonding, Via Holes, Pick and Place, Phased array antennas, SMD, Flip chip, S11, S21 and S22.


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