bullet Sensors & Transducers Journal

    (ISSN: 2306-8515, e-ISSN 1726-5479)

   

   About this Journal

   Information for Authors

   Editorial Board

   Editorial Calendar

   Current Issue

   Browse Journal

S&T journal's cover

Submit Press Release

Submit White Paper

25 Top Downloaded Articles (2007-2012)

Search

Contact Us

 

 

 

 

Vol. 228, Issue 12, December 2018, pp. 63-70

 

Bullet

 

A Novel Approach for Simple, Fast and Cheap Packaging of MEMS and MMIC
 

1, 2 G. A. MERLETTI, 2 J. A. LONAC, 3 J. J. ORTIZ, 4 D. CASULLA, 4 C. F. LONGO, 4 D. de LIMA, 4 C. L. ARRIETA

1 DEINSO-CITEDEF (UNIDEF-MINDEF-CONICET), Juan Bautista de La Salle 4387 (B1603ALO). Buenos Aires (Argentina)
2 CONICET – National Council of Scientific and Technical Research, Godoy Cruz 2290 (C1425FQB) Buenos Aires (Argentina)
3 UTN FRC, Mechanical Engineering Dept, Córdoba (Argentina)
4 Microelectronics Division, DEA-CITEDEF, Villa Martelli, Bs. As. (Argentina)

E-mail: gmeletti@citedef.gob.ar, carrieta@citedef.gob.ar

 

Received: 8 October 2018 /Accepted: 30 November 2018 /Published: 31 December 2018

Digital Sensors and Sensor Sysstems

 

Abstract: The packaging of MEMS and MMIC devices has become a trending topic in the last years. This paper presents a novel approach for MEMS and MMIC packaging. The proposed packaging procedure combines simple single layer printed circuit board (PCB) techniques, Wire-Bonding and 3D printing, resulting in a simple, fast and cheap alternative. Since there is no need for Via Holes the package performance is privileged while the fabrication process is simplified. The novel approach was used in the design and fabrication of a package for a RF MEMS digital phase shifter. The simulation and measurements data are presented alongside with the related conclusions.

 

Keywords: Packaging, MEMS, MMIC, PCB, LTCC, Wire-Bonding, Via Holes, Pick and Place, Phased array antennas, SMD, Flip chip, S11, S21 and S22.

 

Acrobat reader logo Click <here> or title of paper to download the full pages article in pdf format

 

 

This work is licensed under a Creative Commons 4.0 International License

 

 Creative Commons License
 

 

 

 

 

 


1999 - 2018 Copyright ©, International Frequency Sensor Association (IFSA) Publishing, S.L. All Rights Reserved.


Home - News - Links - Archives - Tools - Voltage-to-Frequency Converters - Standardization - Patents - Marketplace - Projects - Wish List - e-Shop - Sensor Jobs - Membership - Videos - Publishing - Site Map - Subscribe - Search

 Members Area -Sensors Portal -Training Courses - S&T Digest - For advertisers - Bookstore - Forums - Polls - Submit Press Release - Submit White Paper - Testimonies - Twitter - Facebook - LinkedIn