bullet Sensors & Transducers Journal

    (ISSN 1726- 5479)

205.767

2008 e-Impact Factor

25 Top Downloaded Articles

Journal Subscription 2010

Editorial Calendar 2010

Submit an Article

Editorial Board

Current Issue

Sensors & Transducers journal's cover

Sensors & Transducers Journal 2008

Sensors & Transducers Journal 2007

2000-2002 S&T e-Digest Contents

2003 S&T e-Digest Contents

2004 S&T e-Digest Contents

2005 S&T e-Digest Contents

2006 S&T e-Digest Contents

 

Best Articles 2008

 

 

 

Vol. 111, Issue 12, December 2009, pp. 18-24

 

Bullet

 

Fabrication Challenges for Realization of Wet Etching Based Comb Type Capacitive Microaccelerometer Structure

 

Shankar DUTTA, R. PAL, P. KUMAR, O. P. HOODA, J. SINGH, Shaveta,
G. SAXENA, P. DATTA and 1R. CHATTERJEE

Solid State Physics Laboratory, Lucknow Road, Timarpur, Delhi -110054, India

1Physics Dept., IIT Delhi, Hauz Khas, New Delhi -110016, India

Tel.: +91-1123971743, fax: +91-1123913609

E-mail: shankardutta77@gmail.com

 

 

Received: 23 October 2009   /Accepted:  22 December 2009   /Published:  30 December 2009

 

Abstract: The current paper presents fabrication of wet etching based comb-type microaccelerometer structure consisting of 47 interdigitated fingers attached to a large proof mass, which is suspended by two narrow torsional beams. Silicon (< 110 >, p-type) was oxidized and the microaccelerometer structure was patterned by photolithography. Desired device thickness was achieved by combination of wet anisotropic etching of 15μm depth and formation of 12 μm thick p++ etch stop layer. Pits of 15 μm were formed in Pyrex glass and metallic lines with bonding pads were formed by UHV Ti-Au metallization and pattern plating (Au). Patterned glass and silicon wafers were aligned and anodically bonded; whereas, the metallic lines and the microaccelerometer anchors are eutectically bonded. Finally, the suspended comb-type device structure consisting of two torsional beams of 5μm width and interdigitated comb fingers of 10μm width is achieved by Dissolve Wafer Process (DWP). The paper highlights the fabrication challenges faced during the realization of the comb-type structure.

 

Keywords: Comb-type accelerometer, Capacitive sensing, Wet etching, Dissolve Wafer Process (DWP)

 

Acrobat reader logo Click <here> or title of paper to download the full pages article (575 Kb)

 

 

 

 


1999 - 2009 Copyright , International Frequency Sensor Association (IFSA). All Rights Reserved.


Home - News - Links - Archives - Tools - Standardization - Patents - Marketplace - Projects - Wish List - Subscribe - Search - Membership - Submit Press Release

 Members Area -Sensors Portal -Training Courses - S&T Digest - For advertisers - Bookstore - Forums - Polls - Sensor Jobs - e-Shop - Site Map