bullet International Frequency Sensor Association (IFSA) Newsletter

   (ISSN 1726-6017)

IFSA logo

 

This monthly e-newsletter, written by the editors of Sensors & Transducers Magazine and Journal (ISSN 1726-5479), delivers the product and research news, end-use application news, information on upcoming events for MEMS and sensors professionals, and updates you on happenings in the sensor science, industry and markets. The Newsletter reports the latest developments in sensor industry as it happens from leading research centers, universities and manufacturers. Who should read this Newsletter ? All who are interested in the newest information and trends in sensors, transducers, MEMS and sensor instrumentation, including DAQ.

 

IFSA Newsletter (ISSN 1726-6017), October 2017

Sponsored Links:

 

Bullet In this Issue:

 

1.   5 sensors related conferences that are worth to visit in 2018

2.   New Issue of Sensors & Transducers journal: Vol. 213, Issue 6, June 2017

3.   Subscription

4.   Additional Information, Comments, Suggestions

 

Plus lots more information to be found on Sensors Web Portal: http://www.sensorsportal.com

 

 


Bullet 5 sensors related conferences that are worth to visit in 2018

 

 

IARIA logo

 

 

1) The 3rd International Conference on Advances in Sensors, Actuators, Metering and Sensing (ALLSENSORS' 2018),

    25-29 March 2018, Rome, Italy
    http://www.iaria.org/conferences2018/ALLSENSORS18.html



Deadline for papers: 23 November 2017

Contributions:

- Regular papers
- Short papers (work in progress)
- Ideas: two pages
- Extended abstracts: two pages
- Posters: two pages
- Posters: slide only
- Presentations: slide only
- Demos: two pages
- Doctoral forum submissions


Proposals for:

- Mini symposia: see http://www.iaria.org/symposium.html

- Workshops: see http://www.iaria.org/workshop.html

- Tutorials

- Panels


Topics:

  • Trends on sensing and sensors types

  • Trends on sensing systems

  • Sensors types

  • Quantum sensors and measurements

  • Cryogenic sensors and systems

  • Biosensors and bio-oriented electronics

  • Sensor technologies and materials

  • Aerospace sensors and sensor systems

  • Sensor-related techniques and methods

  • Transducers, actuators

  • Metering/Measurements

  • Sensing systems

  • Sensor-system algorithms, protocols, communication and computation


ALLSENSORS 2018 Committee:
http://www.iaria.org/conferences2018/ComALLSENSORS18.html


Submission page:
http://www.iaria.org/conferences2018/SubmitALLSENSORS18.html

 


 

HES' 2018 logo

 

 

2) High End Sensors (HSE) 2018 International Conference (10-11 April 2018, Brussels, Belgium)
    http://www.highendsensors.net/home

 

High End Sensors International 2018 will provide comprehensive and complete coverage of the opportunities for all professionals involved within the high-end sensor market. The conference will explore product development within major high-end sensor categories and ways that researchers and manufacturers are investigating to enhance performance, reduce power consumption, and improve efficiency. Co-located with Compound Semiconductor and Photonic Integrated Circuits International, gain access to three cutting edge complimentary conferences and ONE dedicated exhibition featuring leading players from across the globe.Places are limited so book early.

 

IFSA is pleased to be speaking at the high-end sensor industry's must attend global event:

 

 


"High-End Sensors & Sensor Systems: How to achieve high metrological performances"

by Dr. Sergey Y. Yurish (International Frequency Sensor Association):

 

The presentation will describe modern developments and trends in the field of high-end sensors and sensor systems design. Its background is based on programmable parameter-to-frequency (time) converters as a digital sensor’s core and structural-algorithmic methods for data extraction in order to move from a traditional analog-to-digital conversion to alternative frequency (period, duty-cycle, time interval)-to-digital conversion. Working in the frequency-time signal domain simplifies design, and obviates some technical and technological problems, due to the properties of frequency as an informative parameter of sensors and transducers. The major benefits offered by such an approach are high reliability, high metrological performance, wide functionality, cost effectiveness and scalability. Different examples of high-end sensors and sensor systems will be given and discussed in details.

 

http://www.highendsensors.net/marketing/2018/toolkit/htmls/speaker_mailers/hes_ifsa_speaker_sergey_yurish.html

 

Book now to claim 15 % off your attendance fee by using promo code HES01 on our registration page.

Register today for special delegate discount:

http://www.highendsensors.net/register


Places are limited so book early.


 

 


 

3) 1st International Conference on Optics, Photonics and Lasers (OPAL' 2018), 9-11 May 2018, Barcelona, Spain
     http://www.opal-conference.com

 

 

OPAL 2018 will incorporate the following three symposiums covering a broaden range in optics, photonics and lasers, and provide an excellent opportunity to exchange ideas and present latest advancements in these areas. The OPAL'2018 will be organized by IFSA. Media partners: Springer journal 'Lasers in Manufacturing and Materials Processing' (ISSN 2196-7229, e-ISSN 2196-7237), which is indexed by Scopus, and 'Photonics' journal (ISSN 2304-6732).

 

The purpose of OPAL’ 2018 is to bring together leading international researchers, engineers and practitioners interested on any of the optical related technologies. The conference will offer plenary and invited talks, contributed oral and poster presentations, special sessions, tutorials, and exhibitions of commercial products. Social and cultural events will also take place to foster networking among the participants in a friendly manner.

 

 

Submit Abstract:

The online submission system is open for papers on the conference web site:

http://www.opal-conference.com


Please submit 2-page abstract according to the following topics of interest:

  • Optical and Fibre Optical Sensors and Instrumentation

  • Micro-Opto-Electro-Mechanical Systems (MOEMS)

  • Physical Optics

  • Optoelectronic Devices, Photonics, Nanophotonics and Biophotonics

  • Organic Optoelectronics and Integrated Photonics

  • Optical Communications, Switching and Networks

  • High-speed Opto-electronic Networking

  • Optical Fiber Technology: Materials, Devices and Systems

  • Optical Information Processing

  • Holography

  • Optical Metrology

  • Optical Imaging Systems and Machine Vision

  • Optical Computing

  • Guided Wave Optics

  • Optics in Condensed and Soft Matter

  • Quantum Optics

  • Lasers and Laser Applications

  • Nonlinear Optics

  • Nano and Micro Optics

  • Matter Waves

  • Quantum Information

  • Bio and Medical Optics

  • Optical Materials, Characterization Methods and Techniques

  • Optical Methods for Process Control

  • Microscopy and Adaptive Optics

  • Lasers in Medicine and Biology

  • Engineering Applications of Spectroscopy

  • Optical Microscopy of Composites


Contribution Types:

  • Keynote presentations

  • Invited presentations

  • Industrial presentations

  • Regular papers

  • Posters


One event - three publications !

a) All registered abstracts will be published in the conference proceedings (Flash drive edition of published Proceedings with the ISBN).

b) Authors will be invited to submit full-page extended papers to special issue of Sensors and Transducers open access journal (ISSN 2306-8515, e-ISSN 1726-5479). Selected and related high quality extended papers will be published in special issue of Springer's journal 'Lasers in Manufacturing and Materials Processing' (ISSN 2196-7229, e-ISSN 2196-7237), which is indexed by Scopus.

c) The limited number of full-page papers published in the journal will be selected by the Editorial Board to extend for book chapters for the Book Series on 'Advances in Optics: Reviews'.


Special Sessions:

Authors are welcome to organize and manage special sessions during the conference.
Each session will contain 4-6 papers in a related field as specified above.

Session organizers will receive:

1) Certificate of Appreciation
2) Registration fee discounts
3) Special Publishing Theme within Conference Proceedings


The conference's flyer in pdf format can be downloaded at:
https://drive.google.com/open?id=0B_VaYHm3KMfNZXBDRXJZcDczT1E

 

 

Deadlines:

Submission (2-page abstract): 30 January 2018
Notification of acceptance: 28 February 2018
Registration: 15 March 2018
Camera ready (4-6 pages paper): 30 March 201


More details about OPAL'2018 are available at the conference web site:

http://www.opal-conference.com

 

 

OPAL' 2018

 

 



4) 1st International Conference on Microelectronic Devices and Technologies (MicDAT' 2018),20-22 June 2018, Barcelona, Castelldefels, Spain
    http://www.micdat-conference.com

 

A new conference has been launched to provide a forum for open discussion and development of emerging microelectronic devices and technologies. The goal of the conference is to provide an interactive environment for establishing collaborations, exchanging ideas, and facilitating discussion with potential users and sponsors of MicDAT' 2018.

 

MicDAT' 2018 will be organized by IFSA with technical support of Excelera, S.L. (Spain). Media partner - Sensors an Open Access Journal by MDPI.
 


Topics of Interest:

The conference is focusing any significant breakthrough and innovation in microelectronic devices, its applications and technology:

  • Analog, digital, mixed, and RF circuits and related design methodologies

  • Analog-to-Digital Converters (ADC)

  • Voltage-to-Frequency Converts (VFC)

  • Frequency-to-Digital Converters (FDC)

  • Time-to-Digital Converters (TDC)

  • Logic, architectural, and system level synthesis

  • Nonlinear circuits

  • Microprocessors, microcontrollers and DSPs

  • Testing, design for testability, built-in self-test

  • Area, power, and thermal analysis and design

  • Mixed-domain simulation and design

  • Embedded systems, low-power designs

  • VLSI systems circuit and design

  • Non-von Neumann computing and related technologies and circuits

  • Design and test of high complexity systems integration

  • SoC, MPSoC, NoC, SIP, and NIP design and test

  • Process technologies, CMOS, BJT, BiCMOS, GaAs

  • 3-D integration design and analysis

  • Emerging device technologies and circuits, such as FinFETs, SETs, spintronics, SFQ, MTJ, etc.

  • Design for Manufacturability/Technology Optimization/Yield & Quality

  • Microelectronics processing and materials

  • Semiconductor processing

  • Modern electronics materials

  • Solid-state electronics

  • Quantum electronics

  • Thin solid films

  • Nanoprocessing, nanotechnology and nanofabrication

  • Flexible and stretchable electronics

  • MEMS and NEMS

  • CAD tools for microelectronics

  • Hardware/software co-design

  • Algorithms, methods and tools for modeling, simulation, synthesis and verification of ICs

  • Electronic materials science and technology

  • Organic electronic materials and devices

  • Microelectronics reliability and qualification

  • Assembly and Packaging

 

Contribution Types:

  • Keynote presentations

  • Invited presentations

  • Industrial presentations

  • Regular papers

  • Posters

 

One events - three publications !

a) All registered abstracts will be published in the conference proceedings (Flash drive edition of published Proceedings with the ISBN).

b) Authors will be invited to submit full-page extended papers to special issue of Sensors and Transducers open access journal (ISSN 2306-8515, e-ISSN 1726-5479).

c) The limited number of full-page papers published in the journal will be selected by the Editorial Board to extend for book chapters for the Book Series on 'Advances in Microelectronics: Reviews'.


Special Sessions:

Authors are welcome to organize and manage special sessions during the conference. Each session will contain 4-6 papers in a related field as specified above.

Session organizers will receive:

1) Certificate of Appreciation
2) Registration fee discounts
3) Special Publishing Theme within Conference Proceedings

The conference's flyer in pdf format can be downloaded at:

https://drive.google.com/open?id=0B_VaYHm3KMfNc1pDVTU5WF9WWDg

 

 

Deadlines:

Submission (2-page abstract): 28 February 2018
Notification of acceptance: 30 March 2018
Registration: 15 April 2018
Camera ready (4-6 pages paper): 30 April 2018


More details about MicDAT'2018 conference are available at the event's web site:

http://www.micdat-conference.com

 

 


 

5) 4th International Conference on Sensors and Electronic Instrumentation Advances (SEIA' 2018), 19-21 September 2018, Muovenpick Hotel Amsterdam City Centre.

The SEIA conference is focusing any significant breakthrough and innovation in Sensors, Electronics, Measuring Instrumentation and Transducers Engineering Advances and its applications with broadest concept. The conference is organized by the International Frequency Sensor Association (IFSA) and Asian Society of Applied Mathematics and Engineering (ASAME).

 

After successful Series of annual International Conferences on Sensors and Electronic Instrumentation Advances (SEIA): SEIA' 2015 (Dubai, UAE); SEIA' 2016 (Barcelona, Spain) and SEIA' 2017 (Moscow, Russia), the 4th International Conference on Sensors and Electronic Instrumentation Advances (SEIA' 2018) will take place in Amsterdam (The Netherlands), 19-21 September 2018, Muovenpick Hotel Amsterdam City Centre.

 

 

Topics of Interest:

Sensor Technology

  • Accelerometers

  • Inclinometers

  • Gyroscopes

  • Mechanical Sensors

  • Optical Sensors

  • Optical Fiber Sensors

  • Photonic Sensors

  • Chemical Sensors

  • Biosensors

  • Immunosensors

  • BioMEMS

  • Temperature Sensors

  • Pressure Sensors

  • Acoustic Sensors

  • Electromagnetic Sensors

  • Gas Sensors

  • Humidity Sensors

  • Infrared Sensors, Devices and Thermography

  • Radiation Sensors

  • Multi Sensor Fusion

  • Smart Sensors

  • Intelligent Sensors

  • Virtual Sensors

  • Sensor Interfacing and Signal Conditioning

  • Sensor Calibration

  • Nanomaterials and Electronics Technology for Sensors

  • Semiconductor Materials for Sensors

  • Polymer Materials for Sensors

  • MEMS and NEMS

  • Remote Sensors and Telemetry

  • Sensor Applications

 

Sensor Instrumentation and Measuring Technology

  • Metrology and Measurement Science

  • Methods of Measurements

  • Calibrations and Standards

  • Measurement of Electrical Quantities

  • Time and Frequency Measurements

  • Measurement of Force, Mass, Torque, Inclination and Acceleration

  • Magnetic Measurements

  • Hardness Measurements

  • Measurement of Geometrical Quantities

  • Temperature and Thermal Measurements

  • Pressure and Vacuum Measurements

  • Vibration and Noise Measurement

  • Flow Measurements

  • Chemical Measurements

  • Quantum Measurements and Photonics

  • Acoustics and the Ultrasonic Measurements

  • Environmental Measurements

  • Power and Energy Measurements

  • Measurement of Human Functions

  • Measurements in Biology and Medicine

  • Mathematical Tools for Measurements

  • Optical and Radiation Measurements

  • Microwave Measurements

  • Virtual Instruments and Data Acquisition Systems

  • Software Measurements

  • Measurement Systems

  • Distributed Measurements

  • Analog-to-Digital Converters, Digital and Mixed Signal Processing

  • Waveform Analysis and Measurements

  • Scientific and Industrial Instrumentation

  • Cyber-Physical Systems and IoT

  • Experimental Mechanics

  • Measurement in Robotics

  • Metrology in Food and Nutrition

  • Intelligent and Computer Vision Instruments

  • Reliability of Instrument and Measurement Systems

  • Nanometrology

  • Technical Diagnostics and Testing

  • Nondestructive Testing

  • Education and Training in Measurement and Instrumentation

 

Contribution Types:

  • Keynote presentations

  • Invited presentations

  • Industrial presentations

  • Regular papers

  • Posters


One event - three publications !

a) All registered abstracts will be published in the conference proceedings (Flash drive edition of published Proceedings with the ISBN).

b) Authors will be invited to submit full-page extended papers to special issue of Sensors and Transducers open access journal (ISSN 2306-8515, e-ISSN 1726-5479).

c) The limited number of full-page papers published in the journal will be selected by the Editorial Board to extend for book chapters for the Book Series on 'Advances in Sensors: Reviews'.


Chairmen:

Prof., Dr., Sergey Y. Yurish (SYurish@sensorsportal.com)
Dr. Amin Daneshmand Malayeri


More details about the conference will be available on the conference's web site soon.

 

 


Bullet Sensors & Transducers Journal: Contents and Downloads
    
Vol. 216, Issue 9-10, September-October 2017

 

 

Research Articles

 

1) Impedance Based Vitamin D Measurement Sensor and Algorithm for Human Wellness

    Hyung Jin Kim and Jong-Ha Lee, pp.1-7

   [Abstract and Full Page Article Download]

 

2) Fabrication of Novel Amperometric Sensor for the Detection of Zinc Metal as an Environment Pollutant

    Harish Kumar and Neetu Kumari, pp.8-14

   [Abstract and Full Page Article Download]

 

3) Determination of Trace Amount of Cadmium(II) in Environmental Samples by Functionalized Graphene Oxide Modified
    Carbon Paste Electrode

    Tahereh Rohani and Fatemeh Mahdavi, pp.15-20

   [Abstract and Full Page Article Download]

 

4) Finite Element Analysis for Single Cell Temperature Measurement Using PZT-Integrated Micro-capacitive Sensor

    Auwal Shehu Tijjani, Abdullahi Yusuf Sada, Yusuf Abdullahi Badamasi, Mahboob Zakariya and Yusuf Abdurrahman Sambo, pp.21-28

   [Abstract and Full Page Article Download]

 

5) Molecular Doping on Epitaxial Graphene by Gaseous Surface Adsorbents: Influence of Interband Scattering

    B. K. Daas, Goutam Koley, T. S. Sudarshan and M. V. S. Chandrashekhar, pp.29-37

   [Abstract and Full Page Article Download]

Sensors & Transducers journal's cover

 

 

Multi-Configurable Polishing System

 

Maximum flexibility for optical surface processing is now available with NOVA™. This system supports a variety of polishing applications from connectors to waveguides, and bare fibers to custom components.  Wireless tablet control and an Android interface provide the programming freedom required for R&D, with simplified step-by-step operation modes for manufacturing ...

 

Al Cheswick,

Vice President, Sales & Marketing,

11-13 Evergreen Avenue,

Neptune City, NJ 07753, USA

Tel.: 732-775-7355  ext. 10

E-mail: acheswick@krelltech.com

Web: https://krelltech.com/products/connector-polishers

 

Multi-Configurable Polishing System NOVA

 

 

 


  • Bullet Subscriber Service

     

    To subscribe, update your address, renew subscription, pass the Newsletter along to a friend or have them subscribe click <here>  or send e-mail.

     

    Do you have comments or suggestions about this newsletter? Customer feedback is important to us. Please send us your comments and suggestions to Sensors Web Portal at: info@sensorsportal.com

     

     

    Subscribe FREE IFSA Newsletter

    Request free monthly IFSA
     Newsletter (
    ISSN 1726-6017)

    Your e-mail:

     

    Privacy Statement:

     

    At Sensors Web Portal, we take great care with your personal information. We value your privacy and your time. We will never sell, rent or otherwise share your email address or any other contact information you provide us without your express permission.

     

    My Yahoo logo

     

    Sensors Web Portal at Twitter, Facebook and LinkedIn

     

    Sensors Web Portal at Twitter   Sensors Web Portal at LinkedIn   Sensors Web Portal at Facebook

     

     


    Bullet Addition Information

     

    1) Interested in sponsoring IFSA Newsletter ? Please contact us mailto: editor@sensorsportal.com

     

    2) Do you have comments about this newsletter? Send them to editor@sensorsportal.com

     

    3) Need content? You may use this issue at your website, or in your newsletter. The only requirement is inclusion of the following sentence:


    © 2017 Copyright, International Frequency Sensor Association (IFSA). All rights reserved. http://www.sensorsportal.com

       

  • Sensors Web Portal's logo

     

     

    Subscribe FREE IFSA Newsletter

    Request free monthly IFSA
     Newsletter (
    ISSN 1726-6017)

    Your e-mail:

     

     

     

     

    OPAL' 2018

     

     

     

     

    Rapid Publication

     

     

     

     

    IQS Directory

     

     

    Handbook of Thermometry and Nanothermometry

     

     

    Displacement Measurement: new book

     

     

    Digital Sensors and Sensor Sysstems

     

     

    Handbook of Laboratory Measurements

     

    To forward this IFSA Newsletter to a colleague

     

     

    Previous News

     

     


    1999 - 2017 Copyright ©, International Frequency Sensor Association (IFSA). All Rights Reserved.


    Home - News - Links - Archives - Tools - Voltage-to-Frequency Converters - Standardization - Patents - Marketplace - Projects - Wish List - e-Shop - Sensor Jobs - Membership - Videos - Publishing - Site Map - Subscribe - Search

     Members Area -Sensors Portal -Training Courses - S&T Digest - For advertisers - Bookstore - Forums - Polls - Submit Press Release - Submit White Paper - Testimonies - Twitter - Facebook - LinkedIn