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Vol. 235, Issue 7, July 2019, pp. 37-42




Cu/Al Clad and Ag-4Pd Ribbon Bonding for High Power IC Packages

1, * Chun-Hao CHEN, 2 Jan HOEFER, 3 Yen-Cheng LIN, 1 Chia-Ying LIN and 1 Tung-Han CHUANG

1 Institute of Materials Science and Engineering, National Taiwan University, No. 1, Sec. 4, Roosevelt Rd., Taipei 10617, Taiwan
2 Fraunhofer Institute for Reliability and Microintegration IZM, Gustav-Meyer-Allee 25, 13355 Berlin, Germany
3 Wire Technology Co., LTD, No. 27, Aly. 56, Ln. 320, Sec. 1, Shatian Rd., Dadu Dist, Taichung 432, Taiwan
* Tel.: +886-2-3366-1326

* E-mail: d04527008@ntu.edu.tw


Received: 15 April 2019 /Accepted: 28 May 2019 /Published: 31 July 2019

Digital Sensors and Sensor Sysstems


Abstract: Ultrasonic Wire bonding is widely applied in the electronics industry, especially in the field of power integrated circuits (Power IC). In the present work, the bonding interface of Cu/Al clad and Ag-4Pd alloy 100 ===?===m ultra-thin ribbons bonded on different DBC substrates metallized with Ni, Au and Pd were evaluated. The Cu/Al clad ribbons allowed a wider bonding parameter window, and both Cu/Al clad and Ag-4Pd ribbons showed a robust process and high yield rate (over 90 %) during bonding. Microscopic examination of the bonding interfaces showed no cracks or delamination of the metal layers on the substrates, and the interface of the Ag-4Pd ribbon on the DBC substrate remained the same after high temperature storage test (HTST) at 150 C for 1000 h. The pull strengths of the Ag-4Pd ribbons on Cu/Ni substrate were higher, but the yield rate was poor (20 %). On the other hand, DBC substrates metallized with Ni/Pd, Ni/Au, and Ni/Pd/Au films showed superior bonding yield rates (over 90 %) with satisfactory pull strengths. The results indicated that Ag-alloy ribbons could be a great choice for Power IC packaging.


Keywords: Ultrasonic bonding, Ribbon Bonding, Cu/Al clad ribbon, Ag-alloy Ribbon, Power IC.


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