Sensors & Transducers



Vol. 248, Issue 1, January 2021, pp. 1-9





1, * Mahesh Yalagach, 1 Peter Filipp Fuchs, 2 Thomas Antretter,
​ 3 Michael Feuchter, 4 Tao Qi and 5 Markus Weber



1 Polymer Competence Center Leoben GmbH (PCCL), Leoben, Austria

2 Montanuniversität Leoben, Institute of Mechanics, Leoben, Austria

3 Montanuniversität Leoben, Institute of Material Science and Testing of Polymers, Leoben, Austria

4 Austria Technologie & Systemtechnik Aktiengesellschaft, Leoben, Austria

5 ams AG, Premstätten , Austria

1 Tel.: + 43 3842 42962 716

E-mail: mahesh.yalagach@pccl.at



Received: 30 November 2020 /Accepted: 31 December 2020 /Published: 29 January 2021





Abstract: The Micro-Electro-Mechanical Semiconductor (MEMS) sensor packages are an advanced multi-material composite system. These packages comprise polymeric materials like prepregs, solder-mask, insulation, and conductive adhesives. Prepregs are glass fiber reinforced epoxy laminates. Only a low material sensitivity to environmental influences will ensure the sensors' reliable performance during their application lifetime. To this end, the potentially applied materials undergo defined thermal and moisture-dependent material characterization. In this contribution, the influence of moisture and temperature has been studied for five different prepreg materials, which are commonly applied as a substrate material in a MEM'S sensor. The measured thermal and moisture dependent material properties are the basis for a numerical diffusion analysis and a virtual hygro-thermo-mechanical reliability assessment.


Keywords: Thermo-mechanical characterization, Hygroscopic swelling, Thermal and moisture expansion, Tensile tests.

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