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Vol. 103, Issue 4, April 2009, pp.155-160





Sputtered Silicon as a Potential Masking Material for Glass Micromachining A Feasibility Study


1Abhay B. JOSHI, 2Dhananjay BODAS, 1S. A. GANGAL

1 Department of Electronic Science, University of Pune, Pune, India

2 Department of Instrumentation Science, University of Pune, Pune, India

Tel.: +91-202-569-5195, fax: +91-202-569-5301

E-mail: dhananjay.bodas@gmail.com



Received: 12 January 2009   /Accepted: 20 April 2009   /Published: 27 April 2009


Abstract: Present paper reports use of sputtered silicon as a masking material for glass micromachining with hydrofluoric acid (HF) as an etchant. A film of sputtered silicon (sp-Si) having thickness of ~1.4 mm was deposited on glass substrate using DC sputtering system. Sp-Si was patterned using standard photolithographic technique. Glass was etched in HF with varying concentration, to estimate masking behavior of sp-Si. Effect of concentration of HF on sp-Si was studied. Etch depth of 460 mm was obtained with dilute HF (20 %) etchant.


Keywords: MEMS, Glass micromachining, Masking materials


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