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Vol. 123, Issue 12, December 2010, pp.25-34



Investigation Effect of Residual Stress On Pull-In Voltage of Circular Micro Plate Subjected to Nonlinear Electrostatic Force


Farzad Choobdar Rahim

Mechanical Engineering Department, Urmia University, Urmia, Iran

E-mail: farzad_choobdar@yahoo.com



Received: 12 August 2010   /Accepted: 21 December 2010   /Published: 28 December 2010


Abstract: Electrostaticaly actuated circular micro plates are used in the many MEMS devices such as micropumps and optical switches. All such systems exhibit an instability phenomenon, which it is known as the “pull-in” instability. In this paper a distributed model has been used to investigate efficacy of residual stress on the pull-in Phenomenon of circular plate subjected to nonlinear distributed electrostatic pressure. The Circular plate of the micropump was modeled as a thin plate base on Kirchhoff plate theory. The nonlinear coupled electromechanical governing differential equation was discretized using Step by Step Linearization method (S.S.L). The effects of different parameters such as: residual stress, radius and thickness of the plate and initial gap have been studied. The obtained results have been compared with the existing results and were in tune. For this modeling is used MATLAB software.


Keywords: MEMS, Pull-in Voltage, Circular Micro Plate, Residual Stress


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