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Vol. 139, No. 4, April 2012, pp. 1-23




MEMS Non-Silicon Fabrication Technologies


Poonam GOEL

Department of Electrical Communication Engineering,

Indian Institute of Science, Bangalore-560012, India

E-mail: poonam.goel13@gmail.com, poonamgoel@ece.iisc.ernet.in



Received: 31 March 2012   /Accepted: 23 April 2012   /Published: 30 April 2012

Digital Sensors and Sensor Sysstems


Abstract: MEMS technology, due to their potential of compactness and negligible DC-power consumption, has found applications in every field such as communication, automation, navigation, bio-sensors etc. MEMS technology has created the feasibility of making monolithic systems which was not feasible with VLSI technology. Initially MEMS devices were developed using Silicon micromachining. Since a decade, research is being carried out to explore non-Silicon fabrication technologies for MEMS. Various non-Silicon fabrication technologies such as printed circuit board (PCB), low temperature co-fired ceramic (LTCC) and liquid crystal polymers (LCP) in addition to new upcoming technologies such as polymer core conductor and polydimethylsiloxane (PDMS) are being explored to realize MEMS. This paper presents substrate materials with their characteristics, fabrication process and application for these non-Silicon fabrication micromachining technologies.


Keywords: Printed circuit board, Low temperature cofired ceramics, Liquid crystal polymers, Polymer core conductor, Poly-dimethyl siloxane, Microsystem, MEMS



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