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Vol. 259, Issue 5, October 2022, pp. 82-92

 

Bullet

 

Low-cost Integrated Photonic Platform Developed via a Sol-gel Dip-coating Method:
A Brief Review
 

1 Łukasz KOZŁOWSKI, 1 Muhammad SHAHBAZ, 1, * Muhammad Ali BUTT, 2 Cuma TYSZKIEWICZ, 2 Paweł KARASIŃSKI, 1 Andrzej KAŹMIERCZAK and 1 Ryszard PIRAMIDOWICZ

1 Warsaw University of Technology, Institute of Microelectronics and Optoelectronics, Koszykowa 75, 00-662 Warszawa, Poland
2 Silesian University of Technology, Department of Optoelectronics, ul. B. Krzywoustego 2, 44-100 Gliwice, Poland

E-mail: ali.butt@pw.edu.pl

 

Received: 31 August 2022 /Accepted: 3 October 2022 /Published: 31 October 2022

 

 

Abstract: Optical devices and circuits are now key elements in a variety of applications, including biotechnology, automotive, food quality control, chemistry, etc. It is highly desired to find low-cost solutions to the photonics integrated circuits (PICs). In this paper, a comprehensive review of silica-titania (SiO2:TiO2) materials obtained by a sol-gel method come together with a dip-coating technique, and the numerical analysis of different optical devices based on the SiO2:TiO2 optical platform are discussed. The sol-gel method is highly effective and does not require the use of expensive high-tech equipment. We discuss recent progress in our consortium on a cost-effective SiO2:TiO2 optical platform for integrated photonics applications, with a concentration on materials, devices, and optical sensing principles investigated via numerical simulations.

 

Keywords: Integrated photonics, Photonic integrated chip, Photonic sensor, Ring resonator, Grating, Photonic crystal, Silica titania, Sol-gel dip-coating method.

 

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