​ Abstract: This article presents a comparative study of fabrication routes and performance of capacitive pressure sensors, emphasizing the transition from conventional silicon-based platforms to low-cost printed circuit board (PCB) substrates. The proposed method employs sputtered tantalum (Ta) and chromium (Cr) electrodes deposited directly onto the PCB solder mask using a Kapton shadow mask, eliminating the need for photolithography. This simplified process enables scalable and cost-effective sensor manufacturing. Experimental results are evaluated against conventional Si MEMS-based and ceramic capacitive sensors reported in the literature, focusing on sensitivity, hysteresis, linearity, and fabrication complexity. The PCB-based sensors exhibited a clear capacitive response in the 0–5 bar pressure range, with competitive performance and excellent mechanical stability, particularly for Ta electrodes. This work provides an analysis of the advantages and limitations of different fabrication routes and performance metrics, supporting the development of accessible pressure sensors for industrial monitoring, environmental sensing, and emerging IoT applications.

Keywords: Capacitive pressure sensors, PCB technology, MEMS fabrication, Sputtered electrodes, Sensor performance.

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